InfraRed BGA Rework Station
The PDR IR-E6 Evolution rework system is specifically designed to be ultra-accurate and providing the ultimate performance when repairing today’s PCB assemblies.
• Medium – large sized PCBs – SMDs, BGAs, uBGAs including server boards
• Software controlled, Focused IR process
• Highly specified, ultra-accurate system
The system is tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable and produces 100% yield BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips and is ready for 0201 and lead-free applications.
Why InfraRed Over Hot Air
Hot Air BGA Rework stations have been around for about a decade. IR is relatively new in the reworking market.
Hot Air will deliver uneven heating. IR will provide more even heat due to absorption rather than penetration and thus a simple benefit of IR is it can remove plastic components, such as a CPU socket, with IR it penetrates the solder joints and does not burn or melt the plastic.
IR stations tend to use ceramic heating plate, they provide even heat without setting off shift of various other surrounding components due to the lack of air movement, but due to the IR plate being a fixed size, you may need to use high temperature tape to cover the surrounding area of the BGA chip.
IR is cutting edge, it is gaining much more interest, the reason it has a bad name is mainly because of the substandard plates being used. High end plates such as those fitted with Elstein heating elements will perform much better. 99% of game console and laptop reworkers have or are using a cheap IR machine probably from ACHI, Scotle, LY, Honton or OEM China Brands.
Understanding the heat source, applying it properly and ensuring that its the ideal heat source for the job, is where countless fail. Many Laptop Repair Companies attribute their setup as being successful.
Reworking is a science, its anything but just about heating things. Simplistically it will probably appear to be that is all we do, heat the chip and remove it. There are a number of variables involved such as MSL (moisture sensitivity level), package size and type, environmental variables, pcb thickness and quality, copper planes, flux, solderability and more.
Package temperature is also very important, non ROHS, PB, or lead packages would withstand the effects of a temperature of around 235c, while ROHS, PB free, or lead free packages tolerate temperatures of around 260c. When reworking with IR the package temp was very close to the solder ball temp due to the absorbtion technology.
So in conclusion our extensive experience and knowledge in BGA repairs coupled with the best IR station on the market makes us one of the best Laptop Repairers in the country.